Yes, IPC has made a product classification in every standard, including the J-STD-001. This product classification is as follows: IPC J-STD-001 Class 1 - General electronic products (e.g. consumer electronics, these are products where the main requirement is the function [...]
Yes, inside the cup the gold must be removed, otherwise the gold in the cup will dissolve in the solder joint and the solder joint will become more brittle. How to remove the gold is shown in the J-STD-001 training.
Yes that is allowed. It's almost impossible that this will not happen. Due to the heat from the soldering iron, the insulation always melts slightly backwards …..unless you use a heat shunt (heat sink) or a heat-resistant insulation (such as [...]
This depends on the product class. Class 1 products may be repaired at any time. Class 2 also, unless the customer announces this (in advance) in the contract. With class 3 you are not allowed to repair anything without permission [...]
This again depends on the product class. For class 1 and 2 products it is recommended to train the production personnel in the assembly department. In class 3 it is mandatory to follow a soldering training before you are allowed [...]
No, process control is only mandatory for high reliability products (class 3). For class 2 it is recommended but not mandatory. For class 1 (consumer electronics) it is not mandatory, here the end product "only has to work / function". [...]
The assembled printed circuit board must be inspected by either sample inspection according to an established process control plan or by 100% visual inspection. How this works is stated in the J-STD-001 standard.
This is stated in both the IPC-A-610 and the J-STD-001. IPC prescribes that the inspection magnification for cleanliness can take place without magnification (with bare eyes). However, “high density boards” (printed circuit boards on which the components are placed very [...]
Flux residues and other contamination can cause a short circuit due to moisture. The technical terms are: dendritic growth, electromigration, creep current etc. In addition, the conformal coating (the protective varnish) will not or will not adhere well to a [...]
This is described in the J-STD-001. The contamination that remains after soldering is mainly flux residue, but dust and other particles (hair, tin splashes, solder balls, finger spots, etc.) can also remain on the PCB. Is this allowed and how [...]
