FOD is the abbreviation for “Foreign Object Debris” and means contamination by foreign objects (fluff, hair, material residues) on the surface. This abbreviation is often used in the IPC-A-600, IPC-A-610, IPC-6012 and contradicts “Foreign Object Damage” (FOD) which is often [...]
Yes. This is explained in the IPC-6012 training and also in the IPC-A-600, IPC-A-610 and J-STD-001 training program.
Yes, this repair procedure is described in the IPC-7711/7721 standard. The maximum size of a delamination depends on the product class. This is described in the IPC-A-600, the IPC-A-610 and IPC-6012 standard.
Yes, the repair procedure is described in the IPC-7711/7721. The maximum contamination of gold-plated edge contacts is described in the IPC-A-600 and the IPC-A-610 standard.
The IPC-A-600 and the IPC-A-610 describe how much an pad/land may be lifted.
The IPC-A-600 and the IPC-A-610 describes how much a conductor may be damaged maximum in width. This damage depends on the product class and is indicated in %.
AABUS is the abbreviation of “As Agreed Between User and Supplier”. This abbreviation often occurs in an IPC standard.
Yes, IPC has made a product classification in every standard, including the IPC-A-610. This product classification is as follows: IPC-A-610 Class 1 - General electronic products (e.g. consumer electronics, these are products where the main requirement is the function of [...]
Especially when rework with a hot air gun you often see small spots on the PCB surface. Is this allowed? This and more PCB surface damage (such as delamination, blisters, also on flexible printed circuit boards, etc.) are described in [...]
You should never use/assemble damaged components. But if components are assembled undamaged and then machine soldered and they come out of the wave soldering machine / reflow oven with a small damage, then it is good to know what is [...]