FOD is the abbreviation for “Foreign Object Debris” and means contamination by foreign objects (fluff, hair, material residues) on the surface. This abbreviation is often used in the IPC-A-600, IPC-A-610, IPC-6012 and contradicts “Foreign Object Damage” (FOD) which is often [...]
Yes. This is explained in the IPC-6012 training and also in the IPC-A-600, IPC-A-610 and J-STD-001 training program.
Yes, this repair procedure is described in the IPC-7711/7721 standard. The maximum size of a delamination depends on the product class. This is described in the IPC-A-600, the IPC-A-610 and IPC-6012 standard.
This is a test method that allows you to “measure” how long it takes for a drop of solder spreads onto the surface. This test is often performed in a lab on PCBs, components, terminals, wires, contacts, etc.
Nailheading is described in the IPC-A-600 standard. The internal layer of a multi-layer printed circuit board is shaped like a nailhead. This is caused by the manufacturing process.
This is described in the IPC-A-600. The number depends on the product class.
Yes, the repair procedure is described in the IPC-7711/7721. The maximum contamination of gold-plated edge contacts is described in the IPC-A-600 and the IPC-A-610 standard.
The IPC-A-600 and the IPC-A-610 describe how much an pad/land may be lifted.
The IPC-A-600 and the IPC-A-610 describes how much a conductor may be damaged maximum in width. This damage depends on the product class and is indicated in %.
The IPC-A-600J version (from May 2016)