This is a test method that allows you to “measure” how long it takes for a drop of solder spreads onto the surface. This test is often performed in a lab on PCBs, components, terminals, wires, contacts, etc.
This is a test method that allows you to “measure” how long it takes for a drop of solder spreads onto the surface. This test is often performed in a lab on PCBs, components, terminals, wires, contacts, etc.