Both methods are described in the IPC-7711/7721. For large surfaces (THT, plated through holes, large SMD pads such as cooling surfaces) it is better to do this with the desoldering iron, while for small surfaces (SMD Chip 0402 and even [...]
IPC-7711/21 describes that underheating is especially necessary with thick multi-layer printed circuit boards that contain a lot of thermal mass (copper layers). You cannot solder on this PCBs without underheating. Of course, bottom heating is necessary for ceramic and metal [...]
The best way is to prevent the soldering iron tip from oxidizing! This means that after every soldering operation you clean your soldering tip (dry / wet) and then tin it before you put the soldering iron back in the [...]
IPC advises in the IPC-7711/7721 that especially in lead-free soldering it is better to clean the soldering tip with brass wool / brush (dry cleaning) because this will prevent a temperature shock on your soldering iron tip. However, you can [...]
Yes, that's possible. The IPC-7711/7721 lists 4 different types of printed circuit board materials: rigid (type R), flexible (type F), ceramic (type C) and loose wiring / wire wrap printed circuit boards (type W).
In the J-STD-001 training a lot of theoretical background is discussed about the production process and also practical hand soldering is a part of the training program (but only soldering!). In the IPC-7711/7721 training, more attention is paid to practice [...]
