In a BON test (bed or nail tester) the printed circuit board is placed on a test station and test needles are inserted at the bottom to measure the electrical connections. With a flying probe tester, 2 or more needles [...]
The product is heated then cooled, then heated and again cooled, etc. in an oven. With this test method you can quickly test when a product fails.
Tin whiskers are crystals that grow on the surface of a tin coating (on a printed circuit board, plug, drawer, etc.). If these crystals (they look like a cat's whiskers …… hence the name whiskers) become too long, a short [...]
RoHS (Restriction of Hazardous Substances) means the prohibition of harmful substances. This means that some toxic / harmful materials may no longer be used in electronic equipment (think of lead, mercury, chromium, cadmium, etc.). These substances are dangerous for the [...]
Fine-pitch components are SMD components where the leads are spaced very close together. IPC calls the SMDs fine-pitch from a center-to-center (lead distance) of 0.65 mm and smaller. There are also ultra-fine-pitch components, which have a center-to-center distance of 0.3 [...]
The warping of printed circuit boards can be caused by incorrect stacking of the prepreg layers at the printed circuit board manufacturer. This is discussed in the CID/CID+ training.
A “high density board”, translated as a printed circuit board with a high assembly density, is a printed circuit board where the components are placed very close together. Think of a printed circuit board of a laptop, smartphone, iWatch, etc.
The CID / CID+ certificate has no end date. So it is valid forever.
The CID (Certified Interconnect Designer) is the basic training for a printed circuit board designer. The CID+ (Advanced Certified Interconnect Designer) is the follow-up training to the CID training, so for advanced designers.
No, the CID+ is a theory training (discrimination course) for which the participants must largely prepare their self at home (by home study).