IPC-7711/7721C Modules
| Module | Title |
|---|---|
| 1. (Mandatory) | IPC’s Policies & Procedures, General Information and Common Procedures (P&P, Chapter 1 and 2) |
| 2. (Optional) | Wire Spicing with Praxis (Procedure 8.1) |
| 3. (Optional) | Coating |
| 4. (Optional) | Through-Hole Components (THT) with Praxis |
| 5. (Optional) | CHIP and MELF Components (SMT) with Praxis |
| 6. (Optional) | Gull-Wing Components (SMT) with Praxis |
| 7. (Optional) | J-lead Components (SMT) with Praxis |
| 8. (Optional) | BGA Components Theory (TTP) & Modul 8a (Optional): Praxis BGA Desoldering, Reballing, Profiling and Soldering (only possible if BGA Rework Station is available) (currently not available at IPC) |
| 9. (Optional) | Laminate Repair with Praxis |
| 10. (Optional) | Circuit Repair (Conductor/Pad/PTH Repair) with Praxis |
