Qualified Rework & Repair of BGA/CSP/QFN
training and certification
The purpose of this training is to train the participant theoretically but especially practical in the qualified placement and removal of various types of Ball Grid Arrays and Bottom Termination Components (BTC) on printed circuit board assemblies with various types of thermal masses.
This is done according to the relevant international IPC standards such as:
- IPC-7711-7721 Rework, Modification and Repair of Electronic assemblies
- ANSI/J-STD-001 Requirements for Soldered Electrical and Electronic assemblies
- IPC-7093 Design and Assembly Process Implementation for Bottom
- IPC-7095 Design and Assembly Process Implementation for BGAs