Reliability Testing & Defect Analysis for Assemblies Training and Certification

Customers expect you to deliver them reliable products. But reliability is something which shows in the practical application of the end product. The definition of reliability is “the ability of a product to function under given conditions and for a specified period of time without exceeding acceptable failure levels”. The difference in reliability expectations is reflected in the different product classes as specified in several IPC documents.

The problem that an assembler is confronted with is how to guarantee a certain reliability level for the products he produces and delivers to his customers. If the expected lifespan of a product is 10 years for instance he can not wait this period of time to assure the quality of an assembly. This is where specialized testing and analysis methods come in as they have been developed in the electronics industry.

Examples of these test and analysis methods are the burn-in tests and HAST tests that simulate the stresses the product might endure during its operating life. Also inspection techniques like X-Ray and acoustic microscopy are commonly employed, f.i. to acknowledge voiding in BGA solder balls, which might result in premature failure of solder joints.

The Reliability Testing & Defect Analysis for Assemblies Training and Certification is suitable for the following target group:

The Reliability Testing & Defect Analysis for Assemblies Training and Certification would be a good training for everybody who is involved in testing of printed board assemblies. Obviously for those who are actively into the testing and analysis operations, but also for people who deal with the results of the test or analysis for instance on a customer level. Furthermore of course this training could be interesting for anyone who would like to get an understanding of possible failures, the applicable test methods and defect analysis by the nature of their job, like for instance designers, process engineers etc..

Application of the Reliability Testing & Defect Analysis for Assemblies Training and Certification.

Reliability testing and analysis based on X-Ray inspections is not an easy matter. The test methods can be complex, knowing how to operate the equipment is important. But equally important is experience and knowledge on how to interpret the results of the tests and inspections. At the basis of this of course is understanding failure mechanisms that can lead to defects in solder connections and finally quality issues of the finished product. One important topic in this case is voiding in BGA solder connections and obviously this is one of the themes in this training.

The added value of the Reliability Testing & Defect Analysis for Assemblies Training and Certification.

Losing a customer because products you delivered have failed in their working environment costs a lot of money. It might also have an negative impact on your reputation. That is why you would like to assure yourself (and your customer?) that the products are reliable before you ship them. Maybe you even want to know for sure that all is ok while you are still in the prototype or pre-production stage. For this reason reliability tests, inspections and analysis are commonly performed. But many of these themes are not self-explanatory so that is where this Reliability Testing & Defect Analysis for Assemblies Training comes in to help your employees achieve the necessary knowledge.