X-Ray Inspection of Printed Circuit Board Assemblies training and certification

Interpreting X-Ray images is no piece of cake. It takes experience to use the equipment and maybe even more experience to correctly use the information gathered from the system. It is there where this X-Ray Inspection of Printed Circuit Board Assemblies training comes in. On the basis of various IPC documents like IPC-A-610, IPC-7093, IPC-7094 and IPC-7095 the trainer will show how to properly use the X-Ray images for inspection purposes in relationship with the acceptance criteria both for through-hole components as well as SMD components.

Next to general information on the use of X-Ray inspection equipment, the training will go into the inspection of BGA, BTC and flip-chip components. Special attention will be devoted to the various faults and defects that can be detected by X-Ray inspection, faults like voids, misalignment, solder bridging, warpage etc.

The X-Ray Inspection of Printed Circuit Board Assemblies training is suitable for the following target group:

The X-Ray Inspection of Printed Circuit Board Assemblies training is intended for all persons that will have to perform X-ray inspection operations on printed circuit board assemblies or components. This said the target group for this training would be anyway involved with X-ray inspection both at OEM’s and EMS, as well as repair companies that perform X-ray inspection after rework or repair operations. Of course this training also caters for every other individual who has a professional interest in X-ray inspection.

Application of the X-Ray Inspection of Printed Circuit Board Assemblies training.

With the information in this X-Ray Inspection of Printed Circuit Board Assemblies training being very direct and concise and concentrating on how to apply the information from X-Ray images correctly participants get the necessary basic knowledge needed. Since practical experience is important with X-Ray inspection, a lot of practical examples are displayed and discussed. Theory will be kept to a minimum, therefore spending most time on discussing actual images and compare them with the acceptance criteria. The participants will learn to recognize the most common faults that occur and are detectable by X-Ray.

The added value of the X-Ray Inspection of Printed Circuit Board Assemblies training.

X-Ray inspection and diagnosis is not an easy thing. With this training that focusses on this subject participants get a quick but solid insight on the ins-and-outs of X-Ray inspection. They learn to correctly interpret the information gathered from the X-Ray in relationship to the applicable standards, like IPC-A-610 and specific documents like IPC-7093, IPC-7094 and IPC-7095.

To get the most out of this training use the option offered with this training of supplying 75 pictures of your own products that will be analyzed by our trainer and discussed during the training. Obviously we will not use these pictures for other purposes without your consent and they will be treated with the proper confidentiality.