IPC New Release: IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

This IPC-7530A standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This IPC-7530A revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, [...]

By |2020-08-19T09:26:58+02:004 May 2017|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards

The IPC-4101E standard covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for [...]

By |2020-02-05T05:51:27+01:0027 April 2017|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4202B, Flexible Base Dielectrics for Use in Flexible Printed Boards

The IPC-4202B document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for the manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with [...]

By |2020-02-05T05:50:36+01:0021 April 2017|Categories: IPC New Release|Tags: , |