Home/IPC New Release

IPC New Release: IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency [...]

IPC New Release: IPC/WHMA-A-620D Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable [...]

IPC New Release: IPC-WP-024, IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market

IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to [...]

IPC New Release: IPC-7095D, Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7095D describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D, Design and Assembly Process Implementation [...]

IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. IPC New [...]

IPC New Release: IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

The IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount [...]

IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in [...]

IPC New Release: IPC-4203B, Cover and Bonding Material for Flexible Printed Circuitry

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as [...]

IPC New Release: IPC-4591A Requirements for Printed Electronics Functional Conductive Materials

IPC-4591A establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. h2>IPC-4591A Requirements for Printed Electronics Functional Conductive Materials</h2 It provides companies that procure functional materials for printed electronics with [...]

IPC New Release: IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications

IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. IPC-4103B Specification for Base Materials [...]