IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures
IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design guidance and requirements for fabrication drawings, hole to edge spacing, bend area conductor considerations, dielectric thickness between rigid and flexible regions and dual row zero insertion force (ZIF) connectors.
IPC-2223E was Developed by the Flexible Circuits Design Subcommittee (D-11) of the Flexible Circuits Committee (D-10) of IPC
Number of Pages: 60 | Release Date: 1/31/2020 | ISBN: 978-1-951577-00-1
Available at IPC: https://shop.ipc.org/IPC-2223E-English-P
1 Scope
This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid.1.1 Purpose
The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 and may also be used in conjunction with IPC-2222 for the rigid sections of rigid-flex circuits.1.2 Classification of Products
Classification type and use of products shall be in accordance with IPC-2221 and as stated in 1.2.1 and 1.2.2.
Preview the IPC-2223E table of contents .pdf file.
