IPC New Release: IPC-WP-024, IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market

IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to [...]

2020-08-19T09:26:56+02:0023 August 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-7095D, Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7095D describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D, Design and Assembly Process Implementation [...]

2020-01-03T07:03:56+01:0030 July 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. IPC New [...]

2020-08-19T09:26:56+02:0023 May 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

The IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount [...]

2020-08-19T09:26:56+02:0022 May 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in [...]

2020-08-19T09:26:56+02:0018 May 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4203B, Cover and Bonding Material for Flexible Printed Circuitry

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as [...]

2020-01-03T06:51:55+01:0016 May 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4591A Requirements for Printed Electronics Functional Conductive Materials

IPC-4591A establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. h2>IPC-4591A Requirements for Printed Electronics Functional Conductive Materials</h2 It provides companies that procure functional materials for printed electronics with [...]

2020-08-19T09:26:57+02:009 March 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications

IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. IPC-4103B Specification for Base Materials [...]

2020-01-03T06:50:10+01:009 March 2018|Categories: IPC New Release|Tags: , |

IPC New Release: EIA/IPC/JEDEC J-STD-002E – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of [...]

2020-01-03T06:13:49+01:008 March 2018|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-6903A Terms and Definitions for the Design and Manufacture of Printed Electronics

IPC-6903A provides 62 additional terms and definitions for the design and manufacture of printed electronics. IPC-6903A Terms and Definitions for the Design and Manufacture of Printed Electronics The standard creates a common language and understanding for the worldwide printed electronics [...]

2018-03-08T13:27:32+01:008 March 2018|Categories: IPC New Release|Tags: , |