IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits.
IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications
In addition to better definitions of inclusions and how to properly classify them; redefine “substrates” as, “fabricated sheets”; and a more proper definition of thermal conductivity of laminates and bonding material, IPC-4103B also allows the use of low permittivity (dielectric constant) glass reinforcements for laminates and bonding materials, thus improving both the permittivity and loss tangent properties of the materials conforming to this specification.
1.1 Scope This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.
1.2 Type Designation The following system identifies clad and unclad plastic laminate and bonding layer materials for conventional and enhanced part number call out. Conventional laminate part numbers reflect traditional specification values, and are consistent with the callouts in Table 1-1. Enhanced laminate part numbering would include the conventional part number in Table 1-1 as well as the enhanced information in Table 1-2. Bonding layer part numbers are covered in Table 1-3.
Preview the IPC-4103B table of contents .pdf file.
