IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the [...]
Encapsulation, for IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable [...]
The intent of IPC/PERM-2901 design guide is to assist design engineers in developing electronics that are completely Pb-free and meet the demanding requirements of Aerospace, Defense and High Performance (ADHP) systems and products. IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide [...]
The IPC-A-610 standard is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. IPC-A-610G Acceptability [...]
The IPC J-STD-001 standard is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease [...]
IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. IPC-2226A Sectional Design [...]
IPC-9505 standard provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers, and inductors. The test methods can also be [...]
The IPC-7091 standard provides useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. [...]
The IPC-6013D standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried [...]
This IPC-9204 guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. This guideline describes tests which the IPC D-65 Printed Electronics Test Methods and Validation Subcommittee deemed appropriate for consideration for flexibility and stretchability [...]
