IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology.
IPC-2226A Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new coverage of routing density factors and a complete rebuild of feature size recommendations, including aspect ratio, capture and target land sizes. Almost every graphic in Sections 3, 5 and 9 has been revised and/or supplemented with new graphics addressing various microvia formation processes and HDI constructions. Number of pages 48. Released September 2017.
This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.
The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of IPC-2221. In addition, when the core material reflects requirements identified in the sectional standards (IPC-2222, IPC-2223, and IPC-2225), that information becomes a mandatory part of this standard. The standard provides recommendations for signal, power, ground, and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI substrates.
Document Hierarchy Document hierarchy shall be in accordance with the generic standard IPC-2221.
Presentation All dimensions and tolerances in this standard are represented in SI (metric) units with Imperial units following as a hard conversion for reference only (e.g., 0.01 cm [0.0039 in]). In instances of metric based components, dimensions in this standard are represented in SI (metric) units only to prevent an accumulation of errors in rounding with Imperial units. When using predominately metric components, IPC highly recommends doing design layout in a metric environment.
Interpretation Interpretation shall be in accordance with the generic standard IPC-2221.
Classification of HDI Types Classification shall be by category in accordance with the requirements based on end use
and as stated in 1.5.1 and 1.5.2 of this standard.Core Types When HDI products utilize core interconnections, the core type(s) and their materials shall be in accordance with IPC-2222 for rigid and IPC-2223 for flexible core interconnections. For passive or constraining core boards the materials shall be in accordance with IPC-2221.
HDI Types The design designation system of this standard recognizes the six industry approved design types (see 5.2) used in the manufacture of HDI printed boards. The designations in this section determine the HDI design type by defining the number and location of HDI layers that may or may not be combined with a substrate (core [C] or passive [P]). For instance, an HDI printed board with two layers of HDI on one side of the core and one layer of HDI on the other side of the core would be 2 [C] 1.
Preview the IPC-2226A table of contents .pdf file.
