The IPC-6013D standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias.
IPC-6013D, Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-6013D incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, deformation anomalies including wrinkles, creases and soda strawing, marking, registration (annular ring), conductor thickness reductions, dielectric removal in holes, resin smear, copper filled microvias and selective (button) hole plating. Number of pages 80. Released September 2017.
1.1 Statement of Scope This specification covers qualification and performance requirements of flexible printed boards.
The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes (PTHs), and blind/buried vias.
The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017.
The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
1.2 Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible printed boards designed to IPC-2221 and IPC-2223.
1.3 Performance Classification, Board Type, and Installation Usage
1.3.1 Classification This specification recognizes that flexible printed boards will be subject to variations in performance requirements based on end-use. These performance classes (Class 1, Class 2, and Class 3) are defined in IPC-6011.
1.3.2 Printed Board Type Performance requirements are established for the different types of flexible printed boards, classified as follows:
Type 1 – Single-sided flexible printed boards containing one conductive layer, with or without stiffeners.
Type 2 – Double-sided flexible printed boards containing two conductive layers with PTHs, with or without stiffeners.
Type 3 – Multilayer flexible printed boards containing three or more conductive layers with PTHs, with or without
Type 4 – Multilayer rigid and flexible material combinations containing three or more conductive layers with PTHs.
Type 5 – Flexible or rigid-flex printed boards containing two or more conductive layers without PTHs.
1.3.3 Installation Uses
Use A – Capable of withstanding flex during installation.
Use B – Capable of withstanding continuous flexing for the number of cycles as specified on the procurement
Use C – High temperature environment (over 105 °C [221 °F]).
Use D UL – Recognition. See UL 94 and UL 796F.
1.3.4 Selection for Procurement For procurement purposes, performance class and installation usage shall be specified in the procurement documentation.
The documentation shall provide sufficient information to the supplier so that the supplier can fabricate the flexible printed boards and ensure that the user receives the desired product. Information that should be included in the procurement documentation is to be in accordance with IPC-2611 and IPC-2614.
Note: If the drawing specifies the requirement in words, designators are not required.
The procurement documentation shall specify the thermal stress test method and the number of cycles (in relation to reflow profiles in IPC-TM-650, Method 2.6.27) to be used to meet the requirement of 3.6.1. Selection shall be from those depicted in 188.8.131.52, 184.108.40.206, 220.127.116.11 and 18.104.22.168. If not specified (see 5.1), the default shall be per Table 1-1.
Preview the IPC-6013D table of contents .pdf file.