This question we hear at our trainings from time to time. We sometimes even encounter “artists” that have already tried to replace BGA’s (Ball Grid Arrays) with common household appliances and tools. This includes tools such as paint strippers etc. that are for sale in regular hardware stores. This is not always just a hobbyist who wanted to experiment at home, I have seen this kind of practice before even at electronic producing facilities. I guess it is obvious that there is a big risk of damaging the BGA’s, the printed wiring board and neighbouring components.
To get back to the question, no it is not necessarily difficult to replace BGA-components, provided:
- The right equipment is available (rework station).
- You have completed a suitable (BGA rework) training course.
- You have the competence to develop a soldering profile suitable for the product.
- You are skilled in handling the equipment.
- The actions are carried out meticulously.
PIEK has the proper equipment, and our trainers have the skills and qualification to teach the participants the correct handling and use of the equipment, and how to develop soldering profiles. The participants will have to bring their own rigor and ability to work accurately.
EXPERT 10.6 HV van Martin
To replace BGA’s – but also a diversity of other components, like for instance BTC’s – in a professional way. At the moment PIEK has available, apart from some smaller, simpler rework stations, the EXPERT 10.6 HV from Martin and the HR 600 from Ersa in de training room specially equipped for this purpose. Here our students can work with the equipment at hand, supported by our very experienced master trainers. But obviously not before having received thorough instructions.
HR 600 van Ersa
This focuses on the aspects of BGA-components as they can be found in IPC-7095. Of course, this also includes developing the correct (de-)solder profiles. The acceptance criteria for BGA-components as they can be found in IPC-A-610 amongst others are discussed as well. Thus, the trainees will be sufficiently informed on the theoretical aspects. And can then be initiated into the practice of professional replacement of BGA’s.
For this purpose, PIEK has developed a study method in which the participant gets started, with the aid of a folder with instructions, and supported by our trainers. With this hands-on approach, all actions for the proper removal and replacement of BGA’s and the development of (de-)solder profiles are performed and evaluated, using the training PCB, developed by PIEK specifically for this purpose. Of course the abovementioned equipment from Ersa and Martin is available for this and students get to know and practice with them extensively.
Applicable for both machines is that they are equipped with camera systems for optimum positioning of the BGA at their dedicated site on the printed wiring board, and optionally also monitor the soldering process. Placement accuracy and optimum soldering parameters, by following a defined soldering profile (the so called TTP = Time Temperature Profile), are hereby guaranteed. The student will learn the correct operation and will learn how to perform the tasks effectively according to a defined, reproducible process.
If you have the idea that a BGA-course at PIEK might be something for you please don’t hesitate to contact our marketing employee, Mrs. Wendy Wings, for further advice. You can reach her by telephone at +31- (0)45-570 33 33 or by e-mail support@piektraining.com.
