Independent trainers a must
The world is a glass house, and this certainly goes for trainers in the technical interconnect industry. Companies often inadvertently hire IPC trainers who work for the competitor. This means that the competitor can get a behind-the- scenes glimpse of [...]
IEC New Release: IEC TR 61340-5-2 Electrostatics – Protection of electronic devices from electrostatic phenomena
IEC TR 61340-5-2:2018, which has been developed to support IEC 61340-5-1, applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than [...]
IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic AssembliesIPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. IPC New [...]
IPC New Release: IPC-2292: Design Standard for Printed Electronics on Flexible Substrates
The IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount [...]
IPC New Release: IPC/JEDEC J-STD-033D, Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in [...]
IPC New Release: IPC-4203B, Cover and Bonding Material for Flexible Printed Circuitry
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as [...]
IPC New Release: IPC-4591A Requirements for Printed Electronics Functional Conductive Materials
IPC-4591A establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. h2>IPC-4591A Requirements for Printed Electronics Functional Conductive Materials</h2 It provides companies that procure functional materials for printed electronics with [...]
IPC New Release: IPC-4103B Specification for Base Materials for High Speed/High Frequency Applications
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. IPC-4103B Specification for Base Materials [...]
IPC New Release: EIA/IPC/JEDEC J-STD-002E – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of [...]
