IPC New Release: IPC-4921A Requirements for Printed Electronics Base Materials (Substrates)

This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets. 48 pages. Released May 2017. IPC-4921A, Requirements for Printed Electronics Base Materials (Substrates) 1 SCOPE This standard establishes the classification [...]

By |2020-01-03T07:31:54+01:0029 June 2017|Categories: IPC New Release|

IPC New Release: IPC-9204 Guideline on Flexibility and Stretchability Testing for Printed Electronics

This IPC-9204 guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. This guideline describes tests which the IPC D-65 Printed Electronics Test Methods and Validation Subcommittee deemed appropriate for consideration for flexibility and stretchability [...]

By |2020-08-19T09:26:58+02:009 May 2017|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

This IPC-7530A standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This IPC-7530A revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, [...]

By |2020-08-19T09:26:58+02:004 May 2017|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards

The IPC-4101E standard covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for [...]

By |2020-02-05T05:51:27+01:0027 April 2017|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-4202B, Flexible Base Dielectrics for Use in Flexible Printed Boards

The IPC-4202B document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for the manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with [...]

By |2020-02-05T05:50:36+01:0021 April 2017|Categories: IPC New Release|Tags: , |

IPC New Release: IPC-2581B-WAM1 – Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

The IPC-2581B-WAM1 standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for [...]

By |2017-02-14T10:27:30+01:0014 February 2017|Categories: IPC New Release|Tags: |

IPC New Release: IPC-7711/21C Rework, Modification and Repair of Electronic Assemblies ( IPC-7711C/7721C )

The IPC-7711/21C guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused [...]

By |2021-01-18T08:29:56+01:008 February 2017|Categories: IPC New Release|Tags: |

IPC New Release: IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies

The IPC/WHMA-A-620C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many [...]

By |2017-02-07T15:58:12+01:007 February 2017|Categories: IPC New Release|Tags: |

IPC New Release: IPC-9241 Guidelines for Microsection Preparation

The IPC-9241 standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and [...]

By |2017-01-17T15:33:24+01:0017 January 2017|Categories: IPC New Release|Tags: |

IPC New Release: J-STD-046(D)1, Customer Notification Standard for Product / Process Changes by Electronic Product Suppliers

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. More info on the J-STD-046 product page of the IPC portal.

By |2020-01-08T11:55:18+01:0016 November 2016|Categories: IPC New Release|Tags: |