This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.
More info on the J-STD-046 product page of the IPC portal.
Solder mask – gloss or no gloss (that’s the question)
When electronic assemblies are inspected with the aid of an AOI-system (Automated Optical Inspection), it sometimes happens that products are rejected based on deviating colour or degree of gloss. Often the bare board supplier gets [...]
Training Calendar 2025
The PIEK training course calendar 2025 for open registration courses is now available. Here you can find a complete overview of all regional and online courses: https://piektraining.com/en/training-calendar/. In 2025, you can choose from training courses [...]
Replacing BGA-components, is it really that difficult?
This question we hear at our trainings from time to time. We sometimes even encounter “artists” that have already tried to replace BGA’s (Ball Grid Arrays) with common household appliances and tools. This includes tools [...]
Rework, Repair, Touch-up; Do you know the difference?
In practice, many people do not seem to be clear about what is meant when they talk about rework, repair and touch-up. In this article we will try to provide some clarity. A wire [...]
Qualified Rework of Ball Grid Array (BGA)
The qualified rework of a Ball Grid Array (BGA) involves the reworking of a BGA component on a circuit board, i.e. replacing a defective BGA or removing and properly replacing an incorrectly positioned BGA. What [...]
Solder balls on the PCB, are they allowed?
Example of Mid-Chip solder balls (beads) The IPC-A-610H states that solder balls are acceptable for all product classes provided they are entrapped or encapsulated e.g. in no-clean flux residue, under conformal coating, [...]
