This J-STD-609B(D)1 standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:
- those assemblies that are assembled with lead-containing or lead-free solder;
- components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
- the maximum component temperature not to be exceeded during assembly or rework processing;
- the base materials used in the PCB construction, including those PCBs that use halogen-free resin;
- the surface finish of PCBs; and
- the conformal coating on PCBAs.
Replacing BGA-components, is it really that difficult?
This question we hear at our trainings from time to time. We sometimes even encounter “artists” that have already tried to replace BGA’s (Ball Grid Arrays) with common household appliances and tools. This includes tools [...]
Rework, Repair, Touch-up; Do you know the difference?
In practice, many people do not seem to be clear about what is meant when they talk about rework, repair and touch-up. In this article we will try to provide some clarity. A wire [...]
Qualified Rework of Ball Grid Array (BGA)
Qualified Rework of Ball Grid Array houdt in dat een BGA op een printplaat bewerkt wordt, dat wil zeggen, een defecte BGA wordt vervangen of een verkeerd geplaatste BGA wordt verwijderd en op de juiste [...]
Solder balls on the PCB, are they allowed?
Example of Mid-Chip solder balls (beads) The IPC-A-610H states that solder balls are acceptable for all product classes provided they are entrapped or encapsulated e.g. in no-clean flux residue, under conformal coating, [...]
Hand soldering workshop and free ticket to productronica 2023
PIEK invites you to participate in a hand soldering workshop. The workshops will be held on Tuesday, Wednesday and Thursday during the 2023 productronica Fair in Munich. Send an email to workshop@piektraining.com to sign up [...]
Why is it important to test your solder baths for contamination?
During the immersion, wave or selective soldering processes and in the HASL finish application processes, metals will dissolve in the liquid solder. The degree of dissolution depends on the base materials used (finishes on [...]
