IPC-7095D describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D, Design and Assembly Process Implementation [...]
The role of IPC and that of experts in the field You might think that some people at the IPC offices create these standards, but actually they are not developed by IPC. If you look into any standard, you will [...]
If you question yourself if you should use the IPC-A-600 or the IPC-6012, then the question should be what application you want to use it for. If it would be purely to inspect (either the entire board visually or by [...]
This is what one company says (details known to PIEK): Being a company that regularly orders from assembly companies in the technical interconnect industry, we often discuss outsourcing with our customers. Should we ourselves have all the expertise to educate [...]
The world is a glass house, and this certainly goes for trainers in the technical interconnect industry. Companies often inadvertently hire IPC trainers who work for the competitor. This means that the competitor can get a behind-the- scenes glimpse of [...]
IEC TR 61340-5-2:2018, which has been developed to support IEC 61340-5-1, applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than [...]
The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. IPC New [...]
The IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount [...]
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in [...]
