IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as [...]
IPC-4591A establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. h2>IPC-4591A Requirements for Printed Electronics Functional Conductive Materials</h2 It provides companies that procure functional materials for printed electronics with [...]
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. IPC-4103B Specification for Base Materials [...]
IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of [...]
IPC-6903A provides 62 additional terms and definitions for the design and manufacture of printed electronics. IPC-6903A Terms and Definitions for the Design and Manufacture of Printed Electronics The standard creates a common language and understanding for the worldwide printed electronics [...]
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the [...]
Encapsulation, for IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable [...]
The intent of IPC/PERM-2901 design guide is to assist design engineers in developing electronics that are completely Pb-free and meet the demanding requirements of Aerospace, Defense and High Performance (ADHP) systems and products. IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide [...]
The IPC-A-610 standard is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. IPC-A-610G Acceptability [...]
The IPC J-STD-001 standard is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease [...]
