IPC New Release: IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements [...]

IPC New Release: IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

Encapsulation, for IPC-7621 standard, is defined as a low pressure [...]