The IPC-7091 standard provides useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. [...]
The IPC-6013D standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried [...]
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) [...]
Quality in the Electronic Interconnect Industry. Solving the quality problem at the beginning of production prevents the quality defects from appearing in the final assembly. Regardless of whether you are a subcontractor, contractor, supplier or client, regardless of whether you offer [...]
This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets. 48 pages. Released May 2017. IPC-4921A, Requirements for Printed Electronics Base Materials (Substrates) 1 SCOPE This standard establishes the classification [...]
This IPC-9204 guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. This guideline describes tests which the IPC D-65 Printed Electronics Test Methods and Validation Subcommittee deemed appropriate for consideration for flexibility and stretchability [...]
This IPC-7530A standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This IPC-7530A revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, [...]
The IPC-4101E standard covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for [...]
The IPC-4202B document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for the manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with [...]
The term "electrostatic discharge" (known more commonly as ‘ESD') simultaneously strikes fear and disdain in the hearts of electronics engineers. The thought that some do not use proper precaution in dealing with sensitive electronics —or even worse, do not BELIEVE [...]
