Tin whiskers are crystals that grow on the surface of a tin coating (on a printed circuit board, plug, drawer, etc.). If these crystals (they look like a cat's whiskers …… hence the name whiskers) become too long, a short [...]
RoHS (Restriction of Hazardous Substances) means the prohibition of harmful substances. This means that some toxic / harmful materials may no longer be used in electronic equipment (think of lead, mercury, chromium, cadmium, etc.). These substances are dangerous for the [...]
Fine-pitch components are SMD components where the leads are spaced very close together. IPC calls the SMDs fine-pitch from a center-to-center (lead distance) of 0.65 mm and smaller. There are also ultra-fine-pitch components, which have a center-to-center distance of 0.3 [...]
The warping of printed circuit boards can be caused by incorrect stacking of the prepreg layers at the printed circuit board manufacturer. This is discussed in the CID/CID+ training.
A “high density board”, translated as a printed circuit board with a high assembly density, is a printed circuit board where the components are placed very close together. Think of a printed circuit board of a laptop, smartphone, iWatch, etc.
The CID / CID+ certificate has no end date. So it is valid forever.
The CID (Certified Interconnect Designer) is the basic training for a printed circuit board designer. The CID+ (Advanced Certified Interconnect Designer) is the follow-up training to the CID training, so for advanced designers.
No, the CID+ is a theory training (discrimination course) for which the participants must largely prepare their self at home (by home study).
FOD is the abbreviation for “Foreign Object Debris” and means contamination by foreign objects (fluff, hair, material residues) on the surface. This abbreviation is often used in the IPC-A-600, IPC-A-610, IPC-6012 and contradicts “Foreign Object Damage” (FOD) which is often [...]
Yes. This is explained in the IPC-6012 training and also in the IPC-A-600, IPC-A-610 and J-STD-001 training program.