This is stated in a table in the J-STD-001 and in the IPC-6012 standard.
This is stated in the IPC-4552 standard.
In the IPC-4552 standard.
Yes, this repair procedure is described in the IPC-7711/7721 standard. The maximum size of a delamination depends on the product class. This is described in the IPC-A-600, the IPC-A-610 and IPC-6012 standard.
This is a test method that allows you to “measure” how long it takes for a drop of solder spreads onto the surface. This test is often performed in a lab on PCBs, components, terminals, wires, contacts, etc.
Nailheading is described in the IPC-A-600 standard. The internal layer of a multi-layer printed circuit board is shaped like a nailhead. This is caused by the manufacturing process.
This is described in the IPC-A-600. The number depends on the product class.
Yes, the repair procedure is described in the IPC-7711/7721. The maximum contamination of gold-plated edge contacts is described in the IPC-A-600 and the IPC-A-610 standard.
The IPC-A-600 and the IPC-A-610 describe how much an pad/land may be lifted.