The IPC-A-610 standard is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. IPC-A-610G Acceptability [...]
The IPC J-STD-001 standard is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease [...]
IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. IPC-2226A Sectional Design [...]
IPC-9505 standard provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers, and inductors. The test methods can also be [...]
The IPC-7091 standard provides useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. [...]
The IPC-6013D standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried [...]
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) [...]
Quality in the Electronic Interconnect Industry. Solving the quality problem at the beginning of production prevents the quality defects from appearing in the final assembly. Regardless of whether you are a subcontractor, contractor, supplier or client, regardless of whether you offer [...]
This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets. 48 pages. Released May 2017. IPC-4921A, Requirements for Printed Electronics Base Materials (Substrates) 1 SCOPE This standard establishes the classification [...]
This IPC-9204 guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications. This guideline describes tests which the IPC D-65 Printed Electronics Test Methods and Validation Subcommittee deemed appropriate for consideration for flexibility and stretchability [...]
