IPC regularly researches companies in the electronic interconnect industry. One of the recent surveys related to reasons for staff participating in IPC courses and certification routes. This research was held among companies in the Fortune 500, Global 500 and the [...]
In part 2 of the series IPC Edge 2.0, Rob Walls will cover the topics group registration and how to add students.
In part 1 of the series IPC Edge 2.0, Rob Walls will cover the topics log into the IPC Edge 2.0 system and how to purchase credits.
In the picture, you see a gull wing component with according to the IPC J-STD-001 and IPC-A-610 a solder bridge. A solder bridge is a defect for all the product classes. Most used method to resolve this defect is with [...]
Last year, Piek showed the basics of hand soldering, and today we're taking things to a more fundamental level. We'll be talking about the right tools you’re going to need and how to choose them, as well as the proper care and [...]
The electronic interconnect industry is continually innovating, and innovations obviously have a big impact on product quality. Newly created products make the lives of consumers safer, better and more pleasant, regardless of whether they are health-care products, in which technology, [...]
IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to [...]
IPC-7095D describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D, Design and Assembly Process Implementation [...]
