This J-STD-609B(D)1 standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:
- those assemblies that are assembled with lead-containing or lead-free solder;
- components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
- the maximum component temperature not to be exceeded during assembly or rework processing;
- the base materials used in the PCB construction, including those PCBs that use halogen-free resin;
- the surface finish of PCBs; and
- the conformal coating on PCBAs.
ESD audits
Over the past decades PIEK has become known in all of Europe and far beyond as the prominent IPC training center. But unfortunately, not everyone knows that we also offer other services. One of [...]
Solder mask – gloss or no gloss (that’s the question)
When electronic assemblies are inspected with the aid of an AOI-system (Automated Optical Inspection), it sometimes happens that products are rejected based on deviating colour or degree of gloss. Often the bare board supplier gets [...]
Training Calendar 2025
The PIEK training course calendar 2025 for open registration courses is now available. Here you can find a complete overview of all regional and online courses: https://piektraining.com/en/training-calendar/. In 2025, you can choose from training courses [...]
Replacing BGA-components, is it really that difficult?
This question we hear at our trainings from time to time. We sometimes even encounter “artists” that have already tried to replace BGA’s (Ball Grid Arrays) with common household appliances and tools. This includes tools [...]
Rework, Repair, Touch-up; Do you know the difference?
In practice, many people do not seem to be clear about what is meant when they talk about rework, repair and touch-up. In this article we will try to provide some clarity. A wire [...]
Qualified Rework of Ball Grid Array (BGA)
The qualified rework of a Ball Grid Array (BGA) involves the reworking of a BGA component on a circuit board, i.e. replacing a defective BGA or removing and properly replacing an incorrectly positioned BGA. What [...]
