The qualified rework of a Ball Grid Array (BGA) involves the reworking of a BGA component on a circuit board, i.e. replacing a defective BGA or removing and properly replacing an incorrectly positioned BGA. What are BGA‘s? BGAs are microprocessors/components [...]
Example of Mid-Chip solder balls (beads) The IPC-A-610H states that solder balls are acceptable for all product classes provided they are entrapped or encapsulated e.g. in no-clean flux residue, under conformal coating, soldered to a metal surface, [...]
PIEK invites you to participate in a hand soldering workshop. The workshops will be held on Tuesday, Wednesday and Thursday during the 2023 productronica Fair in Munich. Send an email to workshop@piektraining.com to sign up for an available time slot. [...]
During the immersion, wave or selective soldering processes and in the HASL finish application processes, metals will dissolve in the liquid solder. The degree of dissolution depends on the base materials used (finishes on tracks and component leads/metallization’s), solder [...]
Almit and PIEK I.E.C. have worked together for many years. Almit provides the solder to PIEK that is used during courses. And PIEK has given soldering courses at Almit´s facilities for many years. One highlight of the cooperation so far [...]
For PIEK, the go-to educational centre for the electronic interconnect industry,continual cooperation with customers and other stakeholders is the basis of the corporate philosophy. This also goes for Weller, the expert in anything related to manual soldering. Weller is [...]
Recent developments have once again confronted us with the facts. Entire car factories came to a standstill because there were no parts and the new cars could not be finished due to the lack of a few components. Necessary microchips [...]
We can reflow solder Printed Circuit Boards Assemblies (PCBA’s) by using convection ovens, infrared ovens but also with the aid of vapor-phase ovens. We see them quite often at companies that build prototypes or produce a lot of different [...]
The name “no clean flux”, “low solids flux”, or “low activated flux” suggests that these flux residues do not need to be removed because they are harmless to the end product. However, this is not quite correct! No-clean flux [...]
Measuring is Knowing. Guessing is Missing. Measure the temperature profiles and other variables of your reflowsoldering, wavesoldering, vapour-phase-soldering- and rework & repair processes. This can be accomplished quite easily with the Smart Profiler SuperM.O.L.E.® Gold 2 from ECD or [...]
