The term "electrostatic discharge" (known more commonly as ‘ESD') simultaneously strikes fear and disdain in the hearts of electronics engineers. The thought that some do not use proper precaution in dealing with sensitive electronics —or even worse, do not BELIEVE [...]
Tales of introductory soldering are a mix of excitement, fear, and sometimes failure. However, first soldering efforts don’t always need to be daunting or a risk to the success of your project. Although soldering expertise will take many levels of [...]
The IPC-2581B-WAM1 standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for [...]
The IPC-7711/21C guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused [...]
The IPC/WHMA-A-620C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many [...]
The IPC-9241 standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and [...]
This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. More info on the J-STD-046 product page of the IPC portal.
The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard [...]
This J-STD-609B(D)1 standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second [...]
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced [...]
